Apparatus for forming modular sockets using flexible interconnects and resulting structures

ABSTRACT

A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor dice to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of application Ser. No. 10/400,858,filed Mar. 27, 2003, which is a divisional of application Ser. No.10/158,979, filed May 30, 2002, now U.S. Pat. No. 6,612,872, issued Sep.2, 2003, which is a continuation of application Ser. No. 09/876,805,filed Jun. 7, 2001, now U.S. Pat. No. 6,478,627, issued Nov. 12, 2002,which is a continuation of application Ser. No. 09/487,935, filed Jan.20, 2000, now U.S. Pat. No. 6,319,065, issued Nov. 20, 2001, which is acontinuation of application Ser. No. 09/072,260, filed May 4, 1998, nowU.S. Pat. No. 6,089,920, issued Jul. 18, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates generally to methods and apparatus forelectrically connecting semiconductor devices to circuit boards. Moreparticularly, the invention relates to a socket into which one or morebare semiconductor dice may be inserted for connection to a circuitboard without wire bonding of the contact pads of the semiconductor die.

2. State of the Art

The assembly of a semiconductor device from a leadframe andsemiconductor die ordinarily includes bonding of the die to a paddle ofthe leadframe, and wire bonding bond pads on the die to inner leads,i.e., lead fingers of the leadframe. The inner leads, semiconductor die,and bond wires are then encapsulated, and extraneous parts of theleadframe are excised, forming outer leads for connection to a substratesuch as a printed wiring board (PWB).

The interconnection of such packaged integrated circuits (IC) withcircuit board traces has advanced from simple soldering of package leadsto the use of mechanical sockets, also variably known as connectors,couplers, receptacles and carriers. The use of sockets was spurred bythe desire for a way to easily connect and disconnect a packagedsemiconductor die from a test circuit, leading to zero-insertion-force(ZIF), and low-insertion-force (LIF) apparatus. Examples of such arefound in U.S. Pat. No. 5,208,529 of Tsurishima et al., U.S. Pat. No.4,381,130 of Sprenkle, U.S. Pat. No. 4,397,512 of Barraire et al., U.S.Pat. No. 4,889,499 of Sochor, U.S. Pat. No. 5,244,403 of Smith et al.,U.S. Pat. No. 4,266,840 of Seidler, U.S. Pat. No. 3,573,617 of Randolph,U.S. Pat. No. 4,527,850 of Carter, U.S. Pat. No. 5,358,421 of Petersen,U.S. Pat. No. 5,466,169 of Lai, U.S. Pat. No. 5,489,854 of Buck et al.,U.S. Pat. No. 5,609,489 of Bickford et al., U.S. Pat. No. 4,995,825 ofKorsunsky et al., U.S. Pat. Nos. 4,710,134 and 5,209,675 of Korsunsky,U.S. Pat. No. 5,020,998 of Ikeya et al., U.S. Pat. No. 5,628,635 ofIkeya, U.S. Pat. No. 4,314,736 of Deninianiuk, U.S. Pat. No. 4,391,408of Hanlon et al., and U.S. Pat. No. 4,461,525 of Griffin.

New technology has enabled the manufacture of very small high-speedsemiconductor dice having large numbers of closely spaced bond pads.However, wire bonding of such semiconductor dice is difficult on aproduction scale. In addition, the very fine wires are relativelylengthy and have a very fine pitch, leading to electronic noise.

In order to meet space demands, much effort has been expended indeveloping apparatus for stack-mounting of packaged dice on a substratein either a horizontal or vertical configuration. For example,vertically oriented semiconductor packages having leads directlyconnected to circuit board traces are shown in U.S. Pat. No. 5,444,304of Hara et al., U.S. Pat. No. 5,450,289 of Kweon et al., U.S. Pat. No.5,451,815 of Taniguchi et al., U.S. Pat. No. 5,592,019 of Ueda et al.,U.S. Pat. No. 5,619,067 of Sua et al., U.S. Pat. No. 5,635,760 ofIshikawa, U.S. Pat. No. 5,644,161 of Bums, U.S. Pat. No. 5,668,409 ofGaul, and U.S. Reissue Pat. Re. 34,794 of Famworth.

However, none of the above patents relate to the socket interconnectionof a bare (i.e., unpackaged) semiconductor die to a substrate such as acircuit board.

Sockets also exist for connecting daughter circuit boards to amotherboard, as shown in U.S. Pat. No. 5,256,078 of Lwee et al. and U.S.Pat. No. 4,781,612 of Thrush. U.S. Pat. Nos. 4,501,461 and Re. 28,171 ofAnhalt show connectors for connecting a socket to a circuit board, andwiring to an electronic apparatus, respectively.

U.S. Pat. No. 5,593,927 of Farnworth et al. discloses a semiconductordie having an added protective layer and traces, and which is insertableinto a multi-die socket. The conductive edges of the semiconductor dieare connected through an edge “connector” to circuit board traces. Thenumber of insertable semiconductor dice is limited by the number ofsemiconductor die compartments in the socket, and using fewer dice is awaste of space.

BRIEF SUMMARY OF THE INVENTION

A modular bare die socket is provided by which any number of bare(unpackaged) semiconductor dice having bond pads along the edge of onemajor side may be interconnected with a substrate in a densely packedarrangement. The socket is particularly applicable to high speed, e.g.,300 MHZ die of small size or those dice of even faster speeds.

The socket comprises a plurality of plates which have a semiconductordie slot structure for aligning and holding a bare die or dice in avertical orientation, and interconnect structure for aligning andretaining a multi-layer lead tape in contact with conductive bond padsof an inserted die. The interconnect lead tapes have outer ends whichare joined to conductive traces on a substrate such as a printed wiringboard (PWB).

Each lead tape includes a node portion which is forced against a bondpad to make resilient contact therewith. Various means for providing thecontact force include a resilient lead tape, an elastomeric layer ormember biasing the lead tape, or a noded arm of the plate, to which thelead tape is fixed.

A multi-layer interconnect lead tape may be formed from a single layerof polymeric film upon which a pattern of fine pitch electricallyconductive leads is formed. Methods known in the art for forming leadframes, including negative or positive photoresist optical lithography,may be used to form the lead tape. The lead tape may be shaped underpressure to the desired configuration.

The plates with intervening interconnect lead tapes are bonded togetherwith adhesive or other means to form a permanent structure.

The plates are formed of an electrically insulative material and may beidentical. Each plate has “left side structure” and “right sidestructure” which work together with the opposing structure of adjacentplates to achieve the desired alignment and retaining of thesemiconductor die and the lead tape for effective interconnection.

Any number of plates may be joined to accommodate the desired number ofbare semiconductor dice. Assembly is easily and quickly accomplished. Ifdesired, end plates having structure on only one side may be used to capthe ends of the socket.

Thus, a socket is formed as a dense stack of semiconductor die-retainingplates by which the footprint per semiconductor die is much reduced.

The modular socket is low in cost and effectively provides the desiredinterconnection. A short interconnect lead distance is achieved, leadingto reduced noise. The impedance may be matched up to the contact orsemiconductor die.

The primary use of the modular bare semiconductor die socket is intendedto be for permanent attachment to circuit boards of electronic equipmentwhere die replacement will rarely be required. Although the socket maybe used in a test stand for temporarily connecting dice during testing,new testing techniques performed at the wafer scale generally obviatethe necessity for such later tests.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The invention is illustrated in the following figures, wherein theelements are not necessarily shown to scale:

FIG. 1 is a perspective view of a modular socket of the invention;

FIG. 2 is a perspective view of partially assembled modules of a modularsocket of the invention;

FIG. 3 is a cross-sectional edge view of a portion of a modular socketof the invention, as generally taken along line 3—3 of FIG. 1 and havingan exploded portion;

FIG. 4 is a perspective view of a multi-layer lead tape useful in amodular bare die socket of the invention;

FIG. 5 is a plan view of a multi-layer lead tape useful in a modularbare die socket of the invention;

FIG. 5A is a plan view of another embodiment of a multi-layer lead tapeof a modular bare die socket of the invention;

FIG. 6 is a perspective view of a further embodiment of a multi-layerlead tape of a modular bare semiconductor die socket of the invention;

FIG. 7 is a perspective view of partially assembled modules of a furtherembodiment of a modular bare semiconductor die socket of the invention;

FIG. 8 is a perspective view of partially assembled modules of anadditional embodiment of a modular bare semiconductor die socket of theinvention;

FIG. 9 is a cross-sectional edge view of a portion of a furtherembodiment of a modular bare semiconductor die socket of the invention,as taken along line 3—3 of FIG. 1, and having an exploded portion;

FIG. 10 is a cross-sectional edge view of a portion of anotherembodiment of a modular bare semiconductor die socket of the invention,as taken along line 3—3 of FIG. 1;

FIG. 11 is a view of a semiconductor die for use in the modular baresemiconductor die socket of FIG. 10;

FIG. 12 is a view of the semiconductor die of FIG. 11 used in themodular bare semiconductor die socket of FIG. 10; and

FIG. 13 is a view of an alternative embodiment of the semiconductor dieand modular bare semiconductor die socket of FIG. 12 illustrating amodified lead tape.

DETAILED DESCRIPTION OF THE INVENTION

As depicted in drawing FIG. 1, a modular bare die socket 10 of theinvention comprises a plurality of modules 12A, 12B and 12C formed ofplates 14A, 14B, 14C, and 14D which are stacked perpendicular to asubstrate 16. A bare (unpackaged) semiconductor die 18 with conductivebond pads (not visible) near one edge on a major surface 20 thereof,e.g., the “active surface” may be inserted as shown into a die slot 22and have its bond pads interconnected to conductive traces (not visible)on the surface 24 of the substrate 16.

The internal structures of plates 14C and 14D are depicted in drawingFIG. 2. Each of the plates 14A, 14B, 14C and 14D has a first side 26 andan opposing second side 28. The plates 14A, 14B, 14C, and 14D have firstends 30 having die slots 22, and second ends 32 having interconnect leadslots 44 through which lead tapes pass.

In these figures, the first side 26 is taken as the left side of eachplate and the second side 28 is taken as the right side. The regularplates 14A, 14B and 14C have structures on both sides 26, 28 and may bethe exclusive plates of the modular bare die socket 10. The structureprovides for accommodating bare semiconductor dice 18 of a particularsize, number and spacing of bond pads, etc., and for electricallyinterconnecting the semiconductor dice 18 to a substrate 16. Typically,all regular plates 14A, 14B, 14C of a modular bare die socket 10 areidentical but in some cases may differ to accommodate semiconductor diceof different size, bond pad configuration, etc., within differentmodules 12A, 12B, 12C, etc., of a socket.

Alternatively, one or two end plates 14D may be used to cap any numberof intervening regular plates 14A, 14B and 14C. In contrast to theregular plates 14A, 14B and 14C, such end plates 14D have cooperatingstructure on one side only, i.e., the internal side, and may simply havea flat exterior side which in drawing FIGS. 1, 2 and 3 is the secondside 28. Specifically designed end plates 14D may be used on either,neither or both ends of the modular bare die socket 10, and havestructure on one side to complement the facing side of the adjacentregular plates 14A, 14B, 14C.

The structure of the second side 28 of the regular plates 14A, 14B and14C is shown as including an upwardly opening die slot 22 with a sidewall 34, edge walls 38, and stop end wall 36 of lower beam 40. Lowerbeam 40 has an exposed surface 42 which is one side of an interconnectlead slot 44. The lower beam 40 is shown as having a width 41 exceedingwidth 46 for accommodating means for accurate alignment and retention ofa multi-layer interconnect lead tape 50, not shown in drawing FIG. 2 butto be described later in relation to drawing FIGS. 3 through 6.

The first sides 26 of plates 14A, 14B, 14C and 14D are as shown withrespect to end plate 14D. In this embodiment, first side 26 is largelyflat with a recess 48 for accommodating portions of the interconnectlead tape. Recess 48 has a width 60 which is shown to approximate thewidth 46 of the die slot 22, and has a depth 62 which is sufficient totake up the interconnect lead tape 50 when it is compliantly moved intothe recess 48 upon insertion of a semiconductor die 18 into die slot 22.

The module 12C including the first side of plate 14D and the second sideof plate 14C has alignment posts 52 and matching holes 54 for aligningthe plates 14C, 14D to each other. Also shown are alignment/retentionposts 56 and matching holes 58 for (a) aligning and retaining aninterconnect lead tape 50 in the module, and for (b) aligning the plates14C, 14D with each other. The posts 52, 56 and matching holes 54, 58together comprise a module alignment system.

Mating portions of adjacent plates are joined by adhesive followinginstallation of the interconnect lead tape 50 on alignment/retentionposts 56. Each of the posts 52, 56 is inserted into holes 54, 58 so thatall of the plates 14A, 14B, 14C and 14D are precisely aligned with eachother to form a monolithic modular bare die socket 10. In drawing FIG.3, all of the regular plates 14A, 14B, and 14C are identical.

In the views of drawing FIGS. 3 through 5A, a multi-layer interconnectlead tape 50 is shown as comprised of a first insulative layer 64, witha second layer 66 of conductive leads 70A–70C fixed to it. The firstinsulative layer 64 may be formed of a film of polymeric material suchas polyimide, polyimide siloxane, or polyester. A second conductivelayer 66, typically of metal, is formed on the first insulative layer 64in the form of individual leads 70A, 70B, 70C, etc. Methods well-knownin the industry for producing multi-layer lead frames may be used forforming the fine pitch leads 70 on the first insulative layer 64. Thus,for example, the fine pitch leads 70 may be formed by combining metaldeposition with optical lithography using either a positive or negativephotoresist process. Any method capable of providing fine pitch leads 70on the first insulative layer 64 of the interconnect lead tape 50 may beused.

The interconnect lead tape 50 has an upper portion 72 which isconfigured with a total width 76 of fine pitch leads 70 which generallyspans the semiconductor die 18, but will be less than width 46 of dieslot 22 (see FIG. 2). A lower portion 74 has a greater width 78 whichmay correspond generally to width 41 of the lower beam 40 (see FIG. 2).Alignment apertures 80, 82 are formed in the lower portion 74 to becoaxial along axes 84, 86, respectively, with alignment/retention posts56.

The upper portion 72 includes lead portions which contact the bond pads90 of the dice. The lower portion 74 includes lead portions which arejoined to substrate 16 (see FIG. 1).

In the embodiments of drawing FIGS. 3, 4, 5 and 5A, the interconnectlead tape 50 is shown as being formed in the general shape of the letter“S.” A contact node 88 is formed in each fine pitch lead 70 in the upperportion 72 by forming the upper portion as a bend. The node 88 isconfigured to be pushed away by contact with a bond pad 90 of asemiconductor die 18. The resistance to bending of the fine pitch lead70 produces compression therebetween and enables consistent electricalcontact with the bond pad 90 of the semiconductor die 18. Where thesurfaces of the bond pads 90 of the semiconductor die 18 are essentiallycoplanar, contact between the bond pads 90 and the fine pitch leads 70is maintained. The compressive force between the semiconductor die 18and the fine pitch leads 70 is dependent upon the particular material offirst insulative layer 64 and its thickness, the thickness and materialof second conductive layer 66, and lead displacement from the unbiasedposition which results from die insertion. Typically, the firstinsulative layer 64 may vary in thickness from about 12 to about 300 μm.The preferred thickness of the second conductive layer 66 is about 25 toabout 75 μm. The total thickness of the combined first and second layersof the interconnect lead tape 50 is preferred to be from about 75 μm toabout 100 μm.

The lower ends 92 of fine pitch leads 70 are shown as bent to a nearlyhorizontal position for surface attachment to a substrate 16.

The lower ends 92 are shown as having the first insulative layer 64removed to provide a metal surface for attachment by soldering or othermethod to a substrate 16.

In a variation of the interconnect lead tape 50 shown in drawing FIG.5A, the upper ends of the fine pitch leads 70, i.e., the leads in theupper portion 72, may have both the first insulative layer 64 and secondconductive layer 66 removed between the fine pitch leads 70, therebysingulating them. Each fine pitch lead 70 retains both layers 64, 66 forretaining a required resistance to bending in each lead. Thus, each finepitch lead 70 is independently compliant with respect to an insertedsemiconductor die 18 to retain conductive contact with a bond pad 90 onthe semiconductor die 18.

An alternative embodiment of the interconnect lead tape 50 is depictedin drawing FIG. 6. The lower ends 92 of fine pitch leads 70 are bent inthe opposite direction from drawing FIGS. 5 and 5A and in addition, thefirst insulative layer 64 is not removed from the lower ends 92.

The interconnect lead tape 50 may be bent to the desired shape by asuitable stamping tool or the like, wherein the “at-rest” shape isuniform from tape to tape.

The placement of the module components, i.e., the die slot 22, lowerbeam 40, interconnect lead slot 44, and recess 48 may be varied in thelongitudinal direction 94 (see FIG. 3) of the plates, and may beapportioned in any convenient way between the first side 26 of one plateand the facing second side 28 of an adjacent plate.

Turning now to drawing FIGS. 7, 8 and 9, several other embodiments ofthe modular bare die socket 10 are illustrated. As depicted in drawingFIG. 7, a plurality of regular plates 14A, 14B and 14C and an end plate14D, the plates providing for an interconnect lead tape 50 using acompressible elastomeric member 96 (not shown) to bias the interconnectlead tape 50 to the bond pads 90 of the semiconductor die 18. Theelastomeric member 96 may be formed of silicone foam, solid siliconethat has been perforated, or low durometer hardness silicone which isattached to the interconnect lead tape 50 by adhesive. The elastomericmember 96 may be variably shaped as a narrow strip 96A with limitedbiasing strength to a more general coverage 96B with greater biasingstrength. Both are illustrated in drawing FIG. 9. The narrow strip 96Ais intended to be used in the module design of drawing FIG. 7, and thegeneral coverage 96B may be used in the module embodiment of drawingFIG. 8, wherein sufficient space is provided in the interconnect leadslot 44 for the elastomeric member 96. Preferably, the elastomericmember 96 comprises a single continuous unit extending across all of thefine pitch leads 70. Alternatively, a series of elastomeric members 96may be arrayed on the interconnect lead tape 50.

Referring to drawing FIG. 10, illustrated is another form of theinvention, in which the compliant member of a module 12 comprises aprojecting portion 100 of the plate 14. The projecting portion 100 maybe in the form of a ledge, as shown in the figure, and includes alongitudinal ridge 102 within a recess 48 in the first side 26. Amulti-layer interconnect lead tape is attached, e.g., by adhesive, tothe projecting portion 100 and longitudinal ridge 102. The resultingnode 104 in the interconnect lead tape 50 is forced away by an insertedsemiconductor die 18 and forcibly abuts the bond pads 90 on surface 20of semiconductor die 18. The force holding the fine pitch leads 70against inserted bond pads 90 of semiconductor die 18 will depend uponthe distance 106 from the node 104 to the attachment point 108 of thelongitudinal ridge 102. In order to provide the desired effect, thepolymeric material of the plate 14 and projecting portion 100 isselected in combination with distance 106 and ledge thickness 110. Inthis embodiment, it is unnecessary for the interconnect lead tape 50 tobe aligned and retained on alignment posts 52, 56, respectively (seeFIG. 2).

Where a bare semiconductor die 18 has two rows of bond pads 90,illustrated in drawing FIG. 11 as first row 112 and second row 114, theinterconnect lead tape 50 of the modular bare die socket 10 may beadapted for lead contact with both rows. An interconnect lead tape 50for providing contact with two rows 112, 114 of bond pads 90 is shown indrawing FIG. 12. The interconnect lead tape 50 comprises three layersincluding a first insulative layer 64, a second conductive layer 66 forcontacting the first row 112 of bond pads 90, and a third conductivelayer 68 for contacting the second row 114 of bond pads 90 on thesemiconductor die 18. The first and second layers 64, 66 are terminatedat locations 116, 118, respectively, between the first and second rows112, 114 of bond pads 90. An elastomeric member 96C such as a foam isattached to the third layer 68 and abuts the recess wall 120. The member96C is compressed by insertion of the semiconductor die 18 into themodular bare die socket 10 and retains forced contact between the finepitch leads 70 and bond pads 90.

As shown in drawing FIG. 13, the first (insulative polymer) layer 64 mayalternatively be provided with holes 122 through which individual finepitch leads 70 of the third (conductive) layer 68 are pre-inserted forcontact with the second row 114 of bond pads 90.

The foregoing delineates several examples of the use of a multi-layerlead tape with means for contacting the bond pads of a bare die. Othertypes of biasing apparatus may be used for maintaining contact betweenfine pitch leads 70 and the bond pads 90 of a semiconductor die 18,including mechanical springs suitable for the miniature devices.

The plates 14A, 14B, 14C, 14D, etc., may be molded of a suitableinsulative polymeric material, examples of which include polyethersulfone, polyether ether ketone (PEEK), or polyphenylene sulfide.

Following assembly of the modular bare die socket 10 and attachment to asubstrate 16, the modular bare die socket 10, or portions thereof, maybe “glob-topped” with insulative sealant material, typically a polymer.

The modular bare die socket 10 of the invention permits connection ofbare semiconductor dice with very fine pitch bond pads to substrates,whereby short leads are used for improved performance. The semiconductordice may be readily replaced without debonding of wires or other leads.Multiple semiconductor dice may be simultaneously connected to asubstrate, and the apparatus permits high density “stacking” of a largenumber of dice. The socket uses leads which may be produced bywell-developed technology, and is easily made in large quantity and atlow cost.

It is apparent to those skilled in the art that various changes andmodifications may be made to the bare die socket module of theinvention, sockets formed therefrom and methods of making and practicingthe invention as disclosed herein without departing from the spirit andscope of the invention as defined in the following claims. It isparticularly noted that with respect to numbers and dimensions ofelements, the illustrated constructions of the various embodiments ofthe modular bare semiconductor die socket are not presented as alimiting list of features but as examples of the many embodiments of theinvention.

1. An interconnect socket for connecting bond pads of a semiconductordie to traces of a substrate comprising: a multi-layered interconnecttape having a plurality of leads forming at least one of a portion of aresilient member and abutting a portion of a resilient member; and twoattached plates stacked in side-by-side relation forming an insertionslot for a semiconductor die and another tape slot having a portion ofthe multi-layered interconnect tape therein.
 2. The socket of claim 1,wherein a plate of the two plates comprises a plate adhesively securedto an adjacent plate.
 3. The socket of claim 1, wherein each of theplurality of leads is configured for solderless pressure contact withthe bond pads.
 4. The socket of claim 1, further comprising: alignmentkeys located near first ends of the plates, the alignment keyscomprising posts in one of the sides of the two plates and matchingapertures in another of the two sides of the two plates.
 5. The socketof claim 1, further comprising: retention/alignment keys near secondends of the two plates, the retention/alignment keys comprising posts inone of the sides of the two plates and matching apertures in the otherof the sides of the two plates, the posts passed through matchingapertures in the interconnect tape into matching apertures in the twoplates.
 6. The socket of claim 1, wherein outer leads of the pluralityof leads are configured for joining by solder with the traces on thesubstrate.
 7. The socket of claim 1, wherein the substrate comprises acircuit board.
 8. The socket of claim 1, wherein the multi-layeredinterconnect tape comprises a resilient apparatus including aninsulative film to which conductive leads are formed, the insulativefilm to be resiliently displaced by insertion of a semiconductor dieinto the insertion slot.
 9. The socket of claim 1, further wherein themulti-layered interconnect tape comprises a resilient apparatusincluding a compressible elastomeric foam backing on an insulative film.10. The socket of claim 1, wherein the multi-layered interconnect tapecomprises a compressible elastomeric stem between the tape and a plate,the stem compressed by insertion of a semiconductor die into the dieslot.
 11. The socket of claim 1, wherein the multi-layered interconnecttape comprises a narrow projection of a plate of the two plates, thenarrow projection having a node to which the multi-layered interconnecttape is joined to be forcibly bent by insertion of a semiconductor dieinto the insertion slot.
 12. The socket of claim 1, wherein theinsertion slot is located generally between the two plates at the firstends thereof.
 13. The socket of claim 1, wherein the semiconductor diehas two rows of conductive bond pads thereon, and each of the pluralityof leads is formed on both surfaces of the multi-layered interconnecttape, the plurality of leads on a first surface of the multi-layeredinterconnect tape to be connected to one of the rows and the pluralityof leads on a second surface of the multi-layered interconnect tape tobe connected to the other of the rows.
 14. The socket of claim 13,further comprising a layer of elastomeric material fixed to themulti-layered interconnect tape to abut an opposing wall of a plate ofthe two plates for maintaining contact of at least one lead of the leadswith at least one bond pad of the bond pads.
 15. An interconnect socketfor connecting a bond pad of a semiconductor die to traces of asubstrate comprising: a plurality of multi-layered interconnect leadtapes having each layer having a plurality of leads forming at least oneof a portion of a resilient member and abutting a portion of a resilientmember; and two plates, each plate of the two plates stacked inside-by-side relation adjacent each other having a bare die insertionslot and a lead tape insertion slot, one multi-layered interconnect leadtape of the plurality of multi-layered interconnect lead tapes having aportion thereof in the lead tape insertion slot between the two platesin the side-by-side relation of the two plates.
 16. The socket of claim15, wherein a plate of the two plates is adhesively secured to anadjacent plate of the two plates.